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Thick Film Hybrid Technology

The advantage of ceramic hybrids over fiberglass printed circuit is their high reliability due to their inherent rugged construction with the following advantages:

  • High reliability for mission critical and harsh environments
  • Lo co-efficient of thermal expansion
  • Extended temperature range - over 150°c
  • Resistance against vibration
  • Ingress protection against moisture, dust and other contaminants
Service and technology offerings:
  • Surface mount circuit on ceramic thick film technology
  • Laser trimming
  • Circuit test technology
  • Failure mode analysis
  • Special design consideration for rugged and hard environment (Automotive, Defence)

Copyright Hendon Semiconductors 2016

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