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Advanced PCB Assembly (SMT/TH) Contract Manufacturing

Hendon Semiconductors offers a full range of surface mount and through hole technology PCB assembly and contract manufacturing along with value add services including:

  • Process engineering
  • PCB manufacturing
  • Prototyping
  • Engineering advice and services
  • Conformal coating, laser marking and curing
  • Functional, assembly and configuration testing
  • Failure analysis and qualification
  • Procurement, supply chain management and project management
Our manufacturing facility is highly scalable, allowing the manufacture of small run highly technological based products which can be easily scaled upward to volumes exceeding hundreds of thousands of units. We offer:
  • Some of the most advanced manufacturing facilities in Australia
  • Accurate High Speed PCB Assembly
  • Micro BGA and 0201 capabilities
  • Leaded and lead-free technologies and RoHS compliance
  • Skilled production staff
  • Analogue and digital test on circuits
  • Scalable facility

Copyright Hendon Semiconductors 2016

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