Thick Film Hybrid Technology
Hendon Semiconductors designs and manufactures thick film hybrids on a ceramic substrate
The advantage of ceramic hybrids over fiberglass printed circuit is their high reliability due to their inherent rugged construction
- High reliability for mission critical and harsh environments
- Low co-efficient of thermal expansion
- Extended temperature range - over 150°c
- Resistance against vibration
- Ingress protection against moisture, dust and other contaminants
- Circuitry can be epoxy coated for intellectual property protection (anti-tampering/ counterfeiting)
Alternately, this design can also be completed on printed circuit board (PCB).
Our service and technology offering
- Surface mount circuit on ceramic thick film technology
- Laser trimming
- Circuit test technology
- Failure mode analysis
- Special design consideration for rugged and hard environment (Automotive, Defence)
2021-07-15 00:14:00
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